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Compare up to 30 parts.
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Image IIC. Part # Mfr. Part # Mfr. Description Quantity Unit Price
(USD)
Minimum Quantity SeriesTypePackage CooledAttachment MethodShapeLengthWidthDiameterHeight Off Base (Height of Fin)Power Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterialMaterial Finish
102-1488-ND VHS-45 CUI Inc HEATSINK HALF BRICK ALUM BLACK 886 - Immediate 1 -Board LevelHalf Brick DC/DC ConverterBolt OnSquare2.40" (61.00mm)2.264" (57.50mm)-0.450" (11.43mm)-4.6°C/W @ 200 LFM10.3°C/WAluminumBlack Anodized
102-1489-ND VHS-95 CUI Inc HEATSINK HALF BRICK ALUM BLACK 5,762 - Immediate 1 -Board LevelHalf Brick DC/DC ConverterBolt OnSquare2.40" (61.00mm)2.283" (58.00mm)-0.940" (23.88mm)-2.1°C/W @ 200 LFM4.7°C/WAluminumBlack Anodized
231-69PAB-15V-ND 231-69PAB-15V Wakefield Thermal Solutions HEATSINK 934 - Immediate 6,000Non-Stock 231Board Level, VerticalTO-220Bolt On and PC PinRectangular0.690" (17.53mm)0.835" (21.21mm)-0.400" (10.16mm)2W @ 45°C8.0°C/W @ 400 LFM-AluminumPre-Black Anodized
240-118ABH-22-ND 240-118ABH-22 Wakefield Thermal Solutions HEATSINK TO-220 VERT TWIST FIN 558 - Immediate 5,600Non-Stock 240Board Level, VerticalTO-220Bolt On and ClipRectangular1.180" (29.97mm)1.000" (25.40mm)-0.500" (12.70mm)4W @ 55°C5.3°C/W @ 400 LFM13.8°C/WAluminumBlack Anodized
1061-1004-IIC HSCCS-CALBL-001 Nuventix HEATSINK 40W CHIP 30 AL BLACK 230 - Immediate 1 SynJet®Board LevelAssorted (BGA, LGA, CPU, ASIC...)Bolt OnSquare1.969" (50.00mm)1.969" (50.00mm)-1.173" (29.80mm)---Aluminum-
258-IIC 258 Wakefield Thermal Solutions .5X.25X.34 HEATSINK FOR DIODE 813 - Immediate 100Non-Stock 258Board LevelStud Mounted DiodeType 120 CompoundRectangular0.250" (6.35mm)0.500" (12.70mm)-0.340" (8.64mm)--12°C/WAluminumDeltaCoate?151
260-4TH5E-IIC 260-4TH5E Wakefield Thermal Solutions CUP CLIP TRANSISTOR C3488 REV H 681 - Immediate 100Non-Stock 260Board LevelTO-5Bolt OnCylindrical0.400" (10.16mm)0.370" (9.40mm)0.290" (7.37mm) ID---14°C/WBeryllium CopperBlack Ebonol
260-6SH5E-IIC 260-6SH5E Wakefield Thermal Solutions HEAT SINK FOR TO-5 PKG 897 - Immediate 100Non-Stock 260Board LevelTO-5Bolt OnCylindrical0.557" (14.15mm)0.370" (9.40mm)0.290" (7.37mm) ID---14°C/WBeryllium CopperBlack Ebonol
274-3AB-IIC 274-3AB Wakefield Thermal Solutions HEAT SINKS BOARD LEVEL PWR SEMI 834 - Immediate 7,155Non-Stock 274Board LevelTO-220Bolt OnRectangular0.750" (19.05mm)0.520" (13.21mm)-0.250" (6.35mm)2W @ 62°C9.0°C/W @ 400 LFM-AluminumBlack Anodized
0372504040-IIC 0372504040 Molex Inc CHIPSET COOLER CU #1 6500 RPM 879 - Immediate 1Non-Stock --------------
0372505020-IIC 0372505020 Molex Inc CHIPSET COOLER #2 COPPER 6500RPM 815 - Immediate 3,000Non-Stock --------------
1-1542000-2-IIC 1-1542000-2 TE Connectivity HS ASSY PPA CLIP 662 - Immediate 450Non-Stock *
1-1542001-1-IIC 1-1542001-1 TE Connectivity 27MM HS ASSY 12V FAN 770 - Immediate 250Non-Stock *
1-1542001-2-IIC 1-1542001-2 TE Connectivity HS ASSY PPA CLIP 657 - Immediate 225Non-Stock *
1-1542001-9-IIC 1-1542001-9 TE Connectivity 42.5MM HS ASSY ULTE 737 - Immediate 250Non-Stock *
1-1542002-0-IIC 1-1542002-0 TE Connectivity 37.5MM HS ASSY PPA CL 673 - Immediate 400Non-Stock *
1-1542002-1-IIC 1-1542002-1 TE Connectivity HEAT SINK BGA 37.5MM 2FIN RADIAL 210 - Immediate 1 --BGAClipCylindrical--1.375" (34.92mm) OD0.357" (9.07mm)-6.3°C/W @ 200 LFM12°C/WAluminumBlack Anodized
1-1542002-7-IIC 1-1542002-7 TE Connectivity 35MM HS ASSY PPA CLIP 620 - Immediate 350Non-Stock *
1-1542005-2-IIC 1-1542005-2 TE Connectivity 21MM HS ASSY ULTEM CL 977 - Immediate 450Non-Stock *
1-1542005-3-IIC 1-1542005-3 TE Connectivity 21MM HS ASSY ULTEM CL 782 - Immediate 250Non-Stock *
1-1542006-0-IIC 1-1542006-0 TE Connectivity HS 25MM ASSY ULTEM CL 846 - Immediate 350Non-Stock *
1-1542012-7-IIC 1-1542012-7 TE Connectivity 4FIN HS 21MM CLIP ASSEMBLY 847 - Immediate 250Non-Stock *
2007304-1-IIC 2007304-1 TE Connectivity HEAT SINK CLIP QSFP 895 - Immediate 504Non-Stock *
1168-1386-IIC PH3-100-100-0.21-1A t-Global Technology IR HEAT SPREADER/EMITTER W/ADH 9 - Immediate 1 PH3Heat SpreaderAssorted (BGA, LGA, CPU, ASIC...)AdhesiveSquare3.937" (100.00mm)3.937" (100mm)-0.008" (0.21mm)---CopperPolyester
1168-1387-IIC PH3-150-150-0.21-1A t-Global Technology IR HEAT SPREADER/EMITTER W/ADH 5 - Immediate 1 PH3Heat SpreaderAssorted (BGA, LGA, CPU, ASIC...)AdhesiveSquare5.91" (150.00mm)5.91" (150.00mm)-0.008" (0.21mm)---CopperPolyester
1168-1388-IIC PH3-300-300-0.21-1A t-Global Technology IR HEAT SPREADER/EMITTER W/ADH 6 - Immediate 1 PH3Heat SpreaderAssorted (BGA, LGA, CPU, ASIC...)AdhesiveSquare11.81" (300mm)11.811" (300.00mm)-0.008" (0.21mm)---CopperPolyester
1168-1616-IIC XL25-30-30-2 t-Global Technology XL25 CERAMIC BOARD 30X30X2MM 4,826 - Immediate 1 XL-25Heat SpreaderAssorted (BGA, LGA, CPU, ASIC...)-Square1.181" (30.00mm)1.181" (30.00mm)-0.079" (2.00mm)---Ceramic-
1168-1618-IIC XL25-20-20-2 t-Global Technology XL25 CERAMIC BOARD 20X20X2MM 4,484 - Immediate 1 XL-25Heat SpreaderAssorted (BGA, LGA, CPU, ASIC...)-Square0.787" (20.00mm)0.787" (20mm)-0.079" (2.00mm)---Ceramic-
1168-1620-IIC XL25-10-10-2 t-Global Technology XL25 CERAMIC BOARD 10X10X2MM 3,508 - Immediate 1 XL-25Heat SpreaderAssorted (BGA, LGA, CPU, ASIC...)-Square0.394" (10.00mm)0.394" (10.00mm)-0.079" (2.00mm)---Ceramic-
1168-1638-IIC XL25-40-40-3 t-Global Technology XL25 CERAMIC BOARD 40X40X3MM 4,870 - Immediate 1 XL-25Heat SpreaderAssorted (BGA, LGA, CPU, ASIC...)-Square1.575" (40.01mm)1.575" (40.01mm)-0.118" (3.00mm)---Ceramic-
Compare up to 30 parts.
First Previous 1 2 3 4 5 6 7 Next Last
Fan - Accessories
01434-4-6711-3
01434-4-6711
07100-40
07100-60
Fans - Finger Guards, Filters & Accessories
06250-B
06250-C
06250-M
06362-B
Thermal - Accessories
103G
0737390002
109G
125800D00000G
Thermal - Adhesives, Epoxies, Greases, Pastes
161000F00000G
164000F00000G
249G
250G
Thermal - Heat Sinks
VHS-45
VHS-95
231-69PAB-15V
240-118ABH-22
Thermal - Pads, Sheets
140520124-01-G
1601201201-05-R
2305201201-06-R
2405201201-01-R